phone +385 21 784 0072
LIBRISTO 0
Besplatna dostava Overseas kurirskom službom iznad 59.99 €
Overseas 4.99 € Pošta 4.99 € DPD 5.99 € GLS 3.99 € GLS paketomat 3.49 € Box Now 4.49 €
phone Kontakt phoneKako kupovati
Besplatna dostava putem Box Now paketomata i Overseas kurirske službe iznad 59,99 €!

Foldable Flex and Thinned Silicon Multichip Packaging Technology

Jezik EngleskiEngleski
Knjiga Tvrdi uvez
Knjiga Foldable Flex and Thinned Silicon Multichip Packaging Technology John W. Balde
Libristo kod: 01397192
Nakladnici Springer, siječanj 2003
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods use... Cijeli opis
? points 467 b
186.32 €
Vanjske zalihe u manjem broju Šaljemo za 13-16 dana

30 dana za povrat kupljenih proizvoda

Moglo bi vas zanimati i

TOP
Tea at Fortnum & Mason Fortnum & Mason Plc / Tvrdi uvez
common.buy 11.70 €
TOP
Keep Going Austin Kleon / Meki uvez
common.buy 12.41 €
TOP
Maestro Bob Woodward / Meki uvez
common.buy 17.35 €
TOP
Pop Manga Mermaids and Other Sea Creatures Camilla D'Errico / Meki uvez
common.buy 13.52 €
Alfred's Basic Adult All-in-One Course Willard A. Palmer / Meki uvez
common.buy 20.88 €
Last Wish Andrzej Sapkowski / Meki uvez
common.buy 8.87 €
Monetizing Innovation - How Smart Companies Design the Product Around the Price Madhavan Ramanujam / Tvrdi uvez
common.buy 25.93 €
5-Minute Halloween Stories Disney Storybook Art Team / Tvrdi uvez
common.buy 10.99 €
The Greatest Rock Guitar Riffs Alfred Publishing Staff / Meki uvez
common.buy 16.95 €
Punisher: Welcome Back, Frank Garth Ennis / Meki uvez
common.buy 25.43 €
PRIPREMAMO
African Twilight Carol Beckwith / Tvrdi uvez
common.buy 142.21 €
Dismantling Democracy in Venezuela Allan Brewer-Carías / Meki uvez
common.buy 43.80 €
Elite Weapons for LEGO Fanatics Martin Hudepohl / Meki uvez
common.buy 26.44 €
Multiple Dirichlet Series, L-functions and Automorphic Forms Daniel Bump / Tvrdi uvez
common.buy 121.11 €
Intrinsic Properties of Group IV Elements and III-V, II-VI and I-VII Compounds / Intrinsische Eigenschaften von Elementen der IV. Gruppe und von III-V O. Madelung / Tvrdi uvez
common.buy 1 199.23 €
International Law Reports E. LauterpachtC. J. Greenwood / Tvrdi uvez
common.buy 143.32 €

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

Informacije o knjizi

Puni naziv Foldable Flex and Thinned Silicon Multichip Packaging Technology
Autor John W. Balde
Jezik Engleski
Uvez Knjiga - Tvrdi uvez
Datum izdanja 2003
Broj stranica 347
EAN 9780792376767
ISBN 0792376765
Libristo kod 01397192
Nakladnici Springer
Težina 1550
Dimenzije 155 x 235 x 26

Kategorija

Technology, Engineering, Agriculture > Mechanical engineering & materials > Production engineering
Poklonite ovu knjigu još danas
To je jednostavno
1 Dodajte knjigu u košaricu i odaberite isporuku kao poklon 2 Zauzvrat ćemo vam poslati kupon 3 Knjiga dolazi na adresu poklonoprimca

Prijava

Prijavite se na svoj račun. Još nemate Libristo račun? Otvorite ga odmah!

 
obvezno
obvezno
Zaboravljena zaporka

Nemate račun? Ostvarite pogodnosti uz Libristo račun!

Sve ćete imati pod kontrolom uz Libristo račun.

Otvoriti Libristo račun