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Failure Modes and Mechanisms in Electronic Packages

Jezik EngleskiEngleski
Knjiga Meki uvez
Knjiga Failure Modes and Mechanisms in Electronic Packages P. Singh
Libristo kod: 06797043
Nakladnici Springer-Verlag New York Inc., listopad 2012
With the proliferation of packaging technology, failure and reliability have become serious concerns... Cijeli opis
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With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.

Informacije o knjizi

Puni naziv Failure Modes and Mechanisms in Electronic Packages
Autor P. Singh, Puligandla Viswanadham
Jezik Engleski
Uvez Knjiga - Meki uvez
Datum izdanja 2012
Broj stranica 370
EAN 9781461377634
ISBN 1461377633
Libristo kod 06797043
Nakladnici Springer-Verlag New York Inc.
Težina 605
Dimenzije 155 x 235 x 23

Kategorija

Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Electronics: circuits & components
Technology, Engineering, Agriculture > Mechanical engineering & materials > Production engineering
Technology, Engineering, Agriculture > Energy technology & engineering > Electrical engineering
Computing & Information Technology > Computer programming / software engineering > Algorithms & data structures
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