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Design And Modeling For 3d Ics And Interposers

Jezik EngleskiEngleski
Knjiga Tvrdi uvez
Knjiga Design And Modeling For 3d Ics And Interposers Madhavan Swaminathan
Libristo kod: 01995954
Nakladnici WOSQ, prosinac 2013
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehens... Cijeli opis
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152.66 €
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3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Informacije o knjizi

Puni naziv Design And Modeling For 3d Ics And Interposers
Autor Madhavan Swaminathan
Jezik Engleski
Uvez Knjiga - Tvrdi uvez
Datum izdanja 2013
Broj stranica 380
EAN 9789814508599
ISBN 9814508594
Libristo kod 01995954
Nakladnici WOSQ
Težina 673
Dimenzije 235 x 159 x 27

Kategorija

Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Electronic devices & materials
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