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Advanced Materials for Thermal Management of Electronic Packaging

Jezik EngleskiEngleski
Knjiga Meki uvez
Knjiga Advanced Materials for Thermal Management of Electronic Packaging Xingcun Colin Tong
Libristo kod: 01427549
Nakladnici Springer-Verlag New York Inc., veljača 2013
This book offers a comprehensive approach to advanced thermal management in electronic packaging, in... Cijeli opis
? points 766 b
304.82 €
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This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more.

Informacije o knjizi

Puni naziv Advanced Materials for Thermal Management of Electronic Packaging
Autor Xingcun Colin Tong
Jezik Engleski
Uvez Knjiga - Meki uvez
Datum izdanja 2013
Broj stranica 618
EAN 9781461427926
ISBN 1461427924
Libristo kod 01427549
Nakladnici Springer-Verlag New York Inc.
Težina 946
Dimenzije 236 x 243 x 31

Kategorija

Technology, Engineering, Agriculture > Mechanical engineering & materials > Materials science > Engineering thermodynamics
Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Electronics: circuits & components
Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Electronic devices & materials
Mathematics & Science > Physics
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